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  power transistors 1 publication date: january 2003 sjd00117bed 2sc3944, 2sc3944a silicon npn epitaxial planar type for low-frequency driver and high power amplification complementary to 2sa1535 and 2sa1535a features ? excellent collector current i c characteristics of forward current transfer ratio h fe ? high transition frequency f t ? a complementary pair with 2sa1535 and 2sa1535a, is optimum for the driver stage of a 60 w to 100 w output amplifier ? full-pack package which can be installed to the heat sink with one screw absolute maximum ratings t a = 25 c electrical characteristics t a = 25 c 3 c unit: mm note) 1. measuring methods are based on japanese industrial standard jis c 7030 measuring methods for transistors. 2. * : rank classification parameter symbol rating unit collector-base voltage 2sc3944 v cbo 150 v (emitter open) 2sc3944a 180 collector-emitter voltage 2sc3944 v ceo 150 v (base open) 2sc3944a 180 emitter-base voltage (collector open) v ebo 5v collector current i c 1a peak collector current i cp 1.5 a collector power t c = 25 cp c 15 w dissipation 2.0 junction temperature t j 150 c storage temperature t stg ? 55 to + 150 c parameter symbol conditions min typ max unit collector-emitter voltage 2sc3944 v ceo i c = 1 ma, i b = 0 150 v (base open) 2sc3944a 180 emitter-base voltage (collector open) v ebo i e = 10 a, i c = 05v collector-base cutoff current 2sc3944 i cbo v cb = 150 v, i e = 010 a (emitter open) 2sc3944a v cb = 180 v, i e = 010 forward current transfer ratio h fe1 * v ce = 10 v, i c = 150 ma 65 160 330 ? h fe2 v ce = 5 v, i c = 500 ma 50 100 collector-emitter saturation voltage v ce(sat) i c = 500 ma, i b = 50 ma 0.5 2.0 v base-emitter saturation voltage v be(sat) i c = 500 ma, i b = 50 ma 1.0 2.0 v transition frequency f t v ce = 10 v, i c = 50 ma, f = 10 mhz 200 mhz collector output capacitance c ob v cb = 10 v, i e = 0, f = 1 mhz 30 50 pf (common base, input open circuited) rank p q r s h fe1 65 to 110 90 to 155 130 to 220 185 to 330 10.0 0.2 5.5 0.2 7.5 0.2 16.7 0.3 0.7 0.1 14.0 0.5 solder dip (4.0) 0.5 +0.2 ?0.1 1.4 0.1 1.3 0.2 0.8 0.1 2.54 0.3 5.08 0.5 2 13 2.7 0.2 4.2 0.2 4.2 0.2 3.1 0.1 1: base 2: collector 3: emitter eiaj: sc-67 to-220f-a1 package maintenance/ discontinued maintenance/discontinued includes following four product lifecycle stage. planed maintenance type maintenance type planed discontinued typed discontinued type please visit following url about latest information. http://panasonic.net/sc/en
2sc3944, 2sc3944a 2 sjd00117bed p c  t a v ce(sat)  i c v be(sat)  i c h fe  i c f t  i e c ob  v cb safe operation area 0 5 10 15 20 25 collector power dissipation p c (w) ambient temperature t a ( c) 0 160 40 120 80 (1) (2) (1) t c =ta (2) without heat sink (p c =2w) 0.01 0.1 1 0.01 10 1 0.1 collector-emitter saturation voltage v ce(sat) (v) collector current i c (a) i c /i b =10 ?25c 25c t c =100c 0.01 0.01 0.1 1 1 0.1 10 base-emitter saturation voltage v be(sat) (v) collector current i c (a) i c /i b =10 t c =?25c 25c 100c 0.01 0.1 1 1 1 000 100 10 forward current transfer ratio h fe collector current i c (a) v ce =10v t c =100c ?25c 25c 0 100 300 200 400 ? 0.01 ? 0.1 ? 1 transition frequency f t (mhz) emitter current i e (a) v cb =10v f=10mhz t c =25c 1 10 100 0 100 80 60 40 20 collector output capacitance (common base, input open circuited) c ob (pf) collector-base voltage v cb (v) i e =0 f=1mhz t c =25c 0.001 1 0.01 0.1 1 10 10 100 1 000 collector current i c (a) collector-emitter voltage v ce (v) single pulse t c =25c t=10ms t=<50s 2sc3944a 2sc3944 dc i cp i c t=1ms
request for your special attention and precautions in using the technical information and semiconductors described in this book (1) if any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) the technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) the products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). consult our sales staff in advance for information on the following applications: ? special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod- ucts may directly jeopardize life or harm the human body. ? any applications other than the standard applications intended. (4) the products and product specifications described in this book are subject to change without notice for modification and/or im- provement. at the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date product standards in advance to make sure that the latest specifications satisfy your requirements. (5) when designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. otherwise, we will not be liable for any defect which may arise later in your equipment. even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (esd, eos, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. when using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) this book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of matsushita electric industrial co., ltd.


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